Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology. - Tzong-Lin Wu; Jun Fan 001; Francesco de Paulis; Chuen-De Wang; Antonio Ciccomancini Scogna; Antonio Orlandi (IEICE Trans. Commun., 2010)

Power distribution network modeling for 3-D ICs with TSV arrays. - Chi-Kai Shen; Yi-Chang Lu; Yih-Peng Chiou; Tai-Yu Cheng; Tzong-Lin Wu (ASP-DAC, 2013)

Test Generation of Path Delay Faults Induced by Defects in Power TSV. - Chi-Jih Shih; Shih-An Hsieh; Yi-Chang Lu; James Chien-Mo Li; Tzong-Lin Wu; Krishnendu Chakrabarty (Asian Test Symposium, 2013)

Active magnetic field canceling system. - Wei-li Sun; Feng-Chang Chuang; Yu-Lin Song; Chwen Yu; Tzyh-Ghuang Ma; Tzong-Lin Wu; Luh-Maan Chang (EMC Compo, 2013)

Bridging the Gap Between Academia and Industry: MOST 6G Research Program in Taiwan. - Hung-Yu Wei 001; Y.-W. Peter Hong; Wen-Tron Shay; Tzong-Lin Wu (APWCS, 2021)