Through-silicon-via inductor: Is it real or just a fantasy? - Umamaheswara Rao Tida; Cheng Zhuo; Yiyu Shi 001 (ASP-DAC, 2014)

Opportunistic through-silicon-via inductor utilization in LC resonant clocks: concept and algorithms. - Umamaheswara Rao Tida; Varun Mittapalli; Cheng Zhuo; Yiyu Shi 001 (ICCAD, 2014)

"Green" On-chip Inductors in Three-Dimensional Integrated Circuits. - Umamaheswara Rao Tida; Varun Mittapalli; Cheng Zhuo; Yiyu Shi 001 (ISVLSI, 2014)

Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs. - Umamaheswara Rao Tida; Cheng Zhuo; Yiyu Shi 001 (ACM J. Emerg. Technol. Comput. Syst., 2014)

On the Efficacy of Through-Silicon-Via Inductors. - Umamaheswara Rao Tida; Rongbo Yang; Cheng Zhuo; Yiyu Shi 001 (IEEE Trans. Very Large Scale Integr. Syst., 2015)

Modeling and optimization of magnetic core TSV-inductor for on-chip DC-DC converter. - Baixin Chen; Umamaheswara Rao Tida; Cheng Zhuo; Yiyu Shi 001 (ICCAD, 2018)

Single-Inductor-Multiple-Tier Regulation: TSV-Inductor-Based On-Chip Buck Converters for 3-D IC Power Delivery. - Umamaheswara Rao Tida; Cheng Zhuo; Yiyu Shi 001 (IEEE Trans. Very Large Scale Integr. Syst., 2019)

Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (MWSCAS, 2020)

Design and Optimization of Magnetic-core Solenoid Inductor for Multi-phase Buck Converter. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (MWSCAS, 2020)

Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional Integrated Circuits. - Umamaheswara Rao Tida; Madhava Sarma Vemuri (SoCC, 2020)

An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits. - Dawei Li; Madhava Sarma Vemuri; Umamaheswara Rao Tida (CoRR, 2020)

Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking. - Umamaheswara Rao Tida; Cheng Zhuo; Leibo Liu; Yiyu Shi 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020)

Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter. - Chenyi Wen; Xiao Dong; Baixin Chen; Umamaheswara Rao Tida; Yiyu Shi 001; Cheng Zhuo (ACM Trans. Design Autom. Electr. Syst., 2022)

Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (ICCD, 2023)

Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (ISQED, 2023)

Efficient and Scalable MIV-Transistor with Extended Gate in Monolithic 3D Integration. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (MWSCAS, 2023)

FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (SOCC, 2023)

Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor for On-Chip Multi-Phase Buck Converter. - Maliha Elma; Madhava Sarma Vemuri; Umamaheswara Rao Tida (IEEE Access, 2023)

Compact 6T-SRAM Using Bottom-Gate Transistor in FD-SOI Process for Monolithic-3D Integration. - Madhava Sarma Vemuri; Tanvir Ahmed; Umamaheswara Rao Tida (ISVLSI, 2024)

Design Approaches and Consideration for a Reliable and Efficient Monolithic 3D Integration. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (ISVLSI, 2024)

Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (IEEE Access, 2024)

Machine Learning Assisted Magnetic-Core Coupled Inductor Design for Interleaved Buck Converter. - Maliha Elma; Navya Goli; Umamaheswara Rao Tida (ISQED, 2025)

ComplexVCoder: An LLM-Driven Framework for Systematic Generation of Complex Verilog Code. - Jian Zuo; Junzhe Liu; Xianyong Wang; Yicheng Liu; Navya Goli; Tong Xu; Hao Zhang; Umamaheswara Rao Tida; Zhenge Jia; Mengying Zhao (CoRR, 2025)