Shelf Packing to the Design and Optimization of A Power-Aware Multi-Frequency Wrapper Architecture for Modular IP Cores. - Dan Zhao; Unni Chandran; Hideo Fujiwara (ASP-DAC, 2007)

Thermal Driven Test Access Routing in Hyper-interconnected Three-Dimensional System-on-Chip. - Unni Chandran; Dan Zhao (DFT, 2009)

SS-KTC: A High-Testability Low-Overhead Scan Architecture with Multi-level Security Integration. - Unni Chandran; Dan Zhao (VTS, 2009)

Hybrid 3D pre-bonding test framework design. - Unni Chandran; Dan Zhao; Rathish Jayabharathi (ETS, 2013)

Cost-optimal design of wireless pre-bonding test framework. - Unni Chandran; Dan Zhao (SoCC, 2014)