Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser. - Amy S. Fleischer; Ute Troppenz; Michael Hamacher; Werner John (Microelectron. Reliab., 2006)

Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips. - Tobias Hoose; Muhammad Rodlin Billah; Matthias Blaicher; Pablo Marin; Philipp-Immanuel Dietrich; Andreas Hofmann; Ute Troppenz; Martin Möhrle; Nicole Lindenmann; M. Thiel; P. Simon; Jörg Hoffmann; et al. (OFC, 2016)

2 × 56 GB/s from a double side electroabsorption modulated DFB laser. - Michael Theurer; Yin Wang; Li Zeng; Ute Troppenz; Georges Przyrembel; Ariane Sigmund; Martin Moehrle; Martin Schell (OFC, 2016)

Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators. - Muhammad Rodlin Billah; Juned N. Kemal; Pablo Marin-Palomo; Matthias Blaicher; Yasar Kutuvantavida; Clemens Kieninger; Heiner Zwickel; Philipp-Immanuel Dietrich; Stefan Wolf 004; Tobias Hoose; Yilin Xu; Ute Troppenz; et al. (ECOC, 2017)

8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding. - Muhammad Rodlin Billah; Matthias Blaicher; Juned N. Kemal; Tobias Hoose; Heiner Zwickel; Philipp-Immanuel Dietrich; Ute Troppenz; Martin Möhrle; Florian Merget; A. Hofmann; Jeremy Witzens; Sebastian Randel; et al. (OFC, 2017)

Ultra-low power SiGe driver-IC for high-speed electroabsorption modulated DFB lasers. - Jung Han Choi; Marko Gruner; Heinz-Gunter Bach; Michael Theurer; Ute Troppenz; Martin Möhrle; Martin Schell (OFC, 2017)

4 × 56 Gb/s high output power electroabsorption modulated laser array. - Michael Theurer; Martin Moehrle; Ute Troppenz; Heinz-Gunter Bach; Ariane Sigmund; Georges Przyrembel; Martin Schell (OFC, 2017)

InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements. - Yilin Xu; Pascal Maier; Matthias Blaicher; Philipp-Immanuel Dietrich; Pablo Marin-Palomo; Wladislaw Hartmann; Muhammad Rodlin Billah; Ute Troppenz; Martin Möhrle; Sebastian Randel; Wolfgang Freude; Christian Koos (OFC, 2020)

Uncooled 100 GBd O-Band EML for Datacom Transmitter Arrays. - Ute Troppenz; Michael Theurer; Martin Moehrle; Ariane Sigmund; Marko Gruner; Martin Schell (OFC, 2022)

56 GBaud PAM-4 Direct Detection with High-Speed Avalanche Photodiodes. - Tobias Beckerwerth; Christoph Kottke; Volker Jungnickel; Ute Troppenz; Martin Möhrle; Patrick Runge; Martin Schell (OFC, 2023)

4 x 200 Gb/s EML-Array with a Single MQW Layer Stack. - Michael Theurer; Christoph Kottke; Ronald Freund; Felix Ganzer; Patrick Runge; Martin Moehrle; Ute Troppenz; Ariane Sigmund; Martin Schell (OFC, 2023)