Integration of Si-Interposer and High Density MIM Capacitor on 2.5D Foveros Face-to-Face Architecture. - Christopher Pelto; R. Aggarwal; R. Ahan; M. Armstrong; M. Bebek; M. Blount; S. Chowdhury; J. Chuah; C. Connor; T. DeBonis; B. Dhayal; A. Dougless; et al. (VLSI Technology and Circuits, 2024)