Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process. - C. F. Tsang; V. N. Bliznetsov; Y. J. Su (Microelectron. J., 2003)

Process improvement of 0.13mum Cu/Low K (Black DiamondTM) dual damascene interconnection. - H. Y. Li; Y. J. Su; C. F. Tsang; S. M. Sohan; V. N. Bliznetsov; L. Zhang (Microelectron. Reliab., 2005)