Chips and Boards Through MOSIS. - Yehuda Afek; Ronald F. Ayres; David Booth; Danny Cohen; Kathie Fry; Rick Gillespie; Joel Goldberg; Joe Green; David Hollenberg; George Lewicki; Terri Lewis; Lee Richardson; et al. (COMPCON, 1985)

3DIC multi-project-wafer program: A collaboration to provide fabrication access. - Vance Tyree (3DIC, 2010)