Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling. - Vanessa Smet; François Forest; Jean-Jacques Huselstein; Frédéric Richardeau; Zoubir Khatir; Stéphane Lefebvre; Mounira Berkani (IEEE Trans. Ind. Electron., 2011)

Evaluation of Vce Monitoring as a Real-Time Method to Estimate Aging of Bond Wire-IGBT Modules Stressed by Power Cycling. - Vanessa Smet; François Forest; Jean-Jacques Huselstein; Amgad Rashed; Frédéric Richardeau (IEEE Trans. Ind. Electron., 2013)

Miniaturized and high-performance RF packages with ultra-thin glass substrates. - Min Suk Kim; Markondeya Raj Pulugurtha; Youngwoo Kim; Gapyeol Park; Kyungjun Cho; Vanessa Smet; Venky Sundaram; Joungho Kim; Rao R. Tummala (Microelectron. J., 2018)