Modeling and analysis of cracked through silicon via (TSV) interconnections. - Vasileios Gerakis; Christina Avdikou; Alexandros Liolios; Alkis A. Hatzopoulos (DDECS, 2014)

Substrate coupling noise considerations for frequencies up to 100GHz. - Vasileios Gerakis; Alkis A. Hatzopoulos (MIXDES, 2014)

Modeling the Coupling through Substrate for Frequencies up to 100GHz. - Vasileios Gerakis; Fontounasios Christos; Alkis A. Hatzopoulos (DDECS, 2015)

Fault modeling and testing of through silicon via interconnections. - Vasileios Gerakis; Leonidas Katselas; Alkis A. Hatzopoulos (IOLTS, 2015)

Oscillation-based technique for TSV post-bond test considerations. - Stylianos-Georgios Papadopoulos; Vasileios Gerakis; Alkis A. Hatzopoulos (MOCAST, 2017)

Oscillation-based technique for post-bond parallel testing and diagnosis of multiple TSVs. - Stylianos-Georgios Papadopoulos; Vasileios Gerakis; Yiorgos Tsiatouhas; Alkis A. Hatzopoulos (PATMOS, 2017)

An Alternative Post-bond Testing Method for TSVs. - Vasileios Gerakis; Yiorgos Tsiatouhas; Alkis A. Hatzopoulos (MOCAST, 2020)

A Low-Cost, Robust and Tolerant, Digital Scheme for Post-Bond Testing and Diagnosis of TSVs. - Vasileios Gerakis; Yiorgos Tsiatouhas; Alkis A. Hatzopoulos (J. Electron. Test., 2021)

Trends in B2C E-Commerce to Enhance Its Accessibility for Older Adults in Greece. - Vasileios Gerakis; Irena Atanasova; Nadezhda Borisova (Informatica (Slovenia), 2025)