Creep as a reliability problem in MEMS. - Robert Modlinski; Ann Witvrouw; Petar Ratchev; Anne Jourdain; Veerle Simons; H. A. C. Tilmans; Jaap M. J. den Toonder; Robert Puers; Ingrid De Wolf (Microelectron. Reliab., 2004)

Design issues and considerations for low-cost 3D TSV IC technology. - Geert Van der Plas; Paresh Limaye; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Domae Shinichi; Vladimir Cherman; et al. (ISSCC, 2010)

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. - Geert Van der Plas; Paresh Limaye; Igor Loi; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Vladimir Cherman; et al. (IEEE J. Solid State Circuits, 2011)

Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications. - Kris Croes; Veerle Simons; Sofie Beyne; Vladimir Cherman; Herman Oprins; Michele Stucchi; Philippe Absil; A. Glabman; Eric Wilcox (IRPS, 2019)

Assessment of critical Co electromigration parameters. - O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; Philippe J. Roussel; Marleen H. van der Veen; Veerle Simons; Emmanuel Chery; Ivan Ciofi; Kris Croes (IRPS, 2022)

Degradation mechanisms and lifetime assessment of Ge Vertical PIN photodetectors. - Kristof Croes; Veerle Simons; Brecht Truijen; Philippe Roussel; Koen Van Sever; Artemisia Tsiara; Jacopo Franco; Philippe Absil (OFC, 2022)

De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure. - O. Varela Pedreira; Youqi Ding; D. Coenen; Philippe Roussel; Ahmed Sobhi Saleh; Veerle Simons; Houman Zahedmanesh; Ivan Ciofi; Kris Croes (IRPS, 2024)