Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. - Yue Ying Ong; Soon Wee Ho; Kripesh Vaidyanathan; Vasarla Nagendra Sekhar; Ming Chinq Jong; Samuel Lim Yak Long; Vincent Lee Wen Sheng; Leong Ching Wai; Vempati Srinivasa Rao; Jimmy Ong; Xuefen Ong; Xiaowu Zhang; et al. (Microelectron. Reliab., 2010)

IME's capabilities and programs in 2.5D/3DIC. - Vempati Srinivasa Rao (3DIC, 2015)

Machine-learning based methodologies for 3d x-ray measurement, characterization and optimization for buried structures in advanced ic packages. - Ramanpreet Singh Pahwa; Soon Wee Ho; Ren Qin; Richard Chang 002; Oo Zaw Min; Jie Wang 042; Vempati Srinivasa Rao; Tin Lay Nwe; Yanjing Yang; Jens Timo Neumann; Ramani Pichumani; Thomas Gregorich (CoRR, 2021)

Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling. - Surya Bhattacharya; Vempati Srinivasa Rao (VLSI Technology and Circuits, 2023)