Trend from ICs to 3D ICs to 3D systems. - Rao R. Tummala; Venky Sundaram; Ritwik Chatterjee; P. Markodeya Raj; Nitesh Kumbhat; Vijay Sukumaran; Vikay Sridharan; Abhishek Choudury; Qiao Chen; Tapobrata Bandyopadhyay (CICC, 2009)

Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. - Jonghyun Cho; Youngwoo Kim; Joungho Kim; Venky Sundaram; Rao R. Tummala (3DIC, 2013)

Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. - Youngwoo Kim; Jonghyun Cho; Kiyeong Kim; Heegon Kim; Joungho Kim; Srikrishna Sitaraman; Venky Sundaram; Rao R. Tummala (3DIC, 2014)

Miniaturized and high-performance RF packages with ultra-thin glass substrates. - Min Suk Kim; Markondeya Raj Pulugurtha; Youngwoo Kim; Gapyeol Park; Kyungjun Cho; Vanessa Smet; Venky Sundaram; Joungho Kim; Rao R. Tummala (Microelectron. J., 2018)