A design for robust wide metal tracks. - Markus Ackermann 002; Verena Hein; Christian Kovács; Kirsten Weide-Zaage (Microelectron. Reliab., 2012)

Simulation of the influence of TiAl3 layers on the thermal-electrical and mechanical behaviour of Al metallizations. - Jörg Kludt; Kirsten Weide-Zaage; Markus Ackermann 002; Verena Hein (Microelectron. Reliab., 2012)

Dynamic simulation of octahedron slotted metal structures. - Jörg Kludt; Kirsten Weide-Zaage; Markus Ackermann 002; Verena Hein (Microelectron. Reliab., 2013)

Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. - Aymen Moujbani; Jörg Kludt; Kirsten Weide-Zaage; Markus Ackermann 002; Verena Hein; Lutz Meinshausen (Microelectron. Reliab., 2013)

Evaluation new corner stress relief structure layout for high robust metallization. - Verena Hein; Jörg Kludt; Kirsten Weide-Zaage (Microelectron. Reliab., 2014)

Degradation behavior in upstream/downstream via test structures. - Jörg Kludt; Kirsten Weide-Zaage; Markus Ackermann 002; Verena Hein; Christian Kovács (Microelectron. Reliab., 2014)

Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. - Verena Hein; Marco Erstling; Raj Sekar Sethu; Kirsten Weide-Zaage; Tianlin Bai (Microelectron. Reliab., 2016)