Prediction of thermo-mechanical integrity of wafer backend processes. - Viktor Gonda; Jaap M. J. den Toonder; Johan Beijer; G. Q. Zhang; Willem D. van Driel; Romano J. O. M. Hoofman; Leo J. Ernst (Microelectron. Reliab., 2004)

Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. - Viktor Gonda; Kaspar M. B. Jansen; Leo J. Ernst; Jaap M. J. den Toonder; G. Q. Zhang (Microelectron. Reliab., 2007)

Improved RF Devices for Future Adaptive Wireless Systems Using Two-Sided Contacting and AlN Cooling. - Lis K. Nanver; Hugo Schellevis; Tom L. M. Scholtes; Luigi La Spina; Gianpaolo Lorito; Francesco Sarubbi; Viktor Gonda; Milos Popadic; Koen Buisman; Leo C. N. de Vreede; Cong Huang; Silvana Milosavljevic; et al. (IEEE J. Solid State Circuits, 2009)

Sensitivity of the structural behavior of SAC305 interconnects on the variations of creep parameters. - Ramiro Sebastian Vargas Cruz; Viktor Gonda (SACI, 2021)