Fracture phenomena induced by Front-End/Back-End interactions: Dedicated failure analysis and numerical developments. - Sébastien Gallois-Garreignot; Vincent Fiori; D. Nelias (Microelectron. Reliab., 2010)

Thermal correlation between measurements and FEM simulations in 3D ICs. - Papa Momar Souare; François de Crecy; Vincent Fiori; M. Haykel Ben Jamaa; Alexis Farcy; Sébastien Gallois-Garreignot; Andras Borbely; Jean-Philippe Colonna; Perceval Coudrain; B. Giraud; C. Laviron; Séverine Cheramy; et al. (3DIC, 2013)

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. - Benjamin Vianne; Pierre Bar; Vincent Fiori; Sebastien Petitdidier; Norbert Chevrier; Sébastien Gallois-Garreignot; Alexis Farcy; Pascal Chausse; Stéphanie Escoubas; Nicolas Hotellier; Olivier Thomas (3DIC, 2013)

Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. - Vincent Fiori; Sébastien Gallois-Garreignot; Hervé Jaouen; Clément Tavernier (Microelectron. Reliab., 2013)

Using TSVs for thermal mitigation in 3D circuits: Wish and truth. - Cristiano Santos; Papa Momar Souare; François de Crecy; Perceval Coudrain; Jean-Philippe Colonna; Pascal Vivet; Andras Borbely; Ricardo Reis 001; M. Haykel Ben Jamaa; Vincent Fiori; Alexis Farcy (3DIC, 2014)

Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies. - Vincent Fiori; Komi-Atchou Ewuame; Sébastien Gallois-Garreignot; Hervé Jaouen; Clément Tavernier (Microelectron. Reliab., 2014)

Stress management strategy to limit die curvature during silicon interposer integration. - Benjamin Vianne; Alexis Farcy; Vincent Fiori; Cédrick Chappaz; Norbert Chevrier; G. Lobascio; Pascal Chausse; F. Ponthenier; A. Ruckly; Stéphanie Escoubas; Olivier Thomas (3DIC, 2015)

Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test. - Sébastien Gallois-Garreignot; Naceur Benzima; Etienne Benmussa; Caroline Moutin; Pierre-Olivier Bouchard; Vincent Fiori; Clément Tavernier (Microelectron. Reliab., 2015)

Thermo-mechanical characterization of passive stress sensors in Si interposer. - Benjamin Vianne; Pierre Bar; Vincent Fiori; Sébastien Gallois-Garreignot; Komi-Atchou Ewuame; Pascal Chausse; Stéphanie Escoubas; Nicolas Hotellier; Olivier Thomas (Microelectron. Reliab., 2015)

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. - Perceval Coudrain; Papa Momar Souare; Rafael Prieto; Vincent Fiori; Alexis Farcy; Laurent Le Pailleur; Jean-Philippe Colonna; Cristiano Santos; Pascal Vivet; M. Haykel Ben Jamaa; Denis Dutoit; François de Crecy; et al. (IEEE Des. Test, 2016)

Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs. - Giacomo Garegnani; Vincent Fiori; Gilles Gouget; Frederic Monsieur; Clément Tavernier (Microelectron. Reliab., 2016)