3D monolithic integration. - Perrine Batude; Maud Vinet; Arnaud Pouydebasque; Cyrille Le Royer; Bernard Previtali; Claude Tabone; Jean-Michel Hartmann; Loic Sanchez; Laurence Baud; Veronique Carron; Alain Toffoli; Fabienne Allain; et al. (ISCAS, 2011)

Strain and layout management in dual channel (sSOI substrate, SiGe channel) planar FDSOI MOSFETs. - François Andrieu; Mikaël Cassé; E. Baylac; P. Perreau; O. Nier; Denis Rideau; R. Berthelon; Franck Pourchon; A. Pofelski; Barbara De Salvo; C. Gallon; Vincent Mazzocchi; et al. (ESSDERC, 2014)

Opportunities brought by sequential 3D CoolCube™ integration. - Maud Vinet; Perrine Batude; Claire Fenouillet-Béranger; Laurent Brunet; Vincent Mazzocchi; Cao-Minh Vincent Lu; Fabien Deprat; Jessy Micout; Bernard Previtali; Paul Besombes; Nils Rambal; François Andrieu; et al. (ESSDERC, 2016)

Recent advances in 3D VLSI integration. - Claire Fenouillet-Béranger; Perrine Batude; Laurent Brunet; Vincent Mazzocchi; Cao-Minh Vincent Lu; Fabien Deprat; Jessy Micout; M.-P. Samson; Bernard Previtali; Paul Besombes; Nils Rambal; François Andrieu; et al. (ICICDT, 2016)