Real-Time 3-D Thermal Simulation of Advanced Packages via Generative Adversarial Networks. - Seunghyun Hwang; Michael Joseph Smith; Vinicius C. Do Nascimento; Qiang Qiu 001; Cheng-Kok Koh; Ganesh Subbarayan; Dan Jiao (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2025)