Design issues and considerations for low-cost 3D TSV IC technology. - Geert Van der Plas; Paresh Limaye; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Domae Shinichi; Vladimir Cherman; et al. (ISSCC, 2010)

Analysis of microbump induced stress effects in 3D stacked IC technologies. - Andrej Ivankovic; Geert Van der Plas; V. Moroz; M. Choi; Vladimir Cherman; Abdelkarim Mercha; Paul Marchal; Marcel Gonzalez; Geert Eneman; Wenqi Zhang; Thibault Buisson; Mikael Detalle; et al. (3DIC, 2011)

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. - Geert Van der Plas; Paresh Limaye; Igor Loi; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Vladimir Cherman; et al. (IEEE J. Solid State Circuits, 2011)

Fine grain thermal modeling and experimental validation of 3D-ICs. - Herman Oprins; Adi Srinivasan; Miroslav Cupák; Vladimir Cherman; Cristina Torregiani; Michele Stucchi; Geert Van der Plas; Paul Marchal; Bart Vandevelde; E. Cheng (Microelectron. J., 2011)

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. - Wei Guo; Geert Van der Plas; Andrej Ivankovic; Geert Eneman; Vladimir Cherman; Bart De Wachter; Abdelkarim Mercha; Mario Gonzalez; Yann Civale; Augusto Redolfi; Thibault Buisson; A. Jourdan; et al. (ICICDT, 2012)

Effect of the functionalization process on the performance of SiGe MEM resonators used for bio-molecular sensing. - Ahmad Khaled; Moatassim Raoof; Vladimir Cherman; Karoline Jans; Mohammad Abbas; Shaker Ebrahim; Goerge Bryce; Peter Verheyen; Ann Witvrouw; Ingrid De Wolf (Microelectron. Reliab., 2012)

MEMS packaging and reliability: An undividable couple. - Harrie A. C. Tilmans; Jeroen De Coster; Philippe Hélin; Vladimir Cherman; Anne Jourdain; Piet De Moor; Bart Vandevelde; Nga P. Pham; Joseph Zekry; Ann Witvrouw; Ingrid De Wolf (Microelectron. Reliab., 2012)

Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges. - Joeri De Vos; Vladimir Cherman; Mikael Detalle; Teng Wang; Abdellah Salahouelhadj; Robert Daily; Geert Van der Plas; Eric Beyne (3DIC, 2014)

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. - Bart Vandevelde; Andrej Ivankovic; B. Debecker; Melina Lofrano; Kris Vanstreels; Wei Guo; Vladimir Cherman; Marcel Gonzalez; Geert Van der Plas; Ingrid De Wolf; Eric Beyne; Zsolt Tokei (Microelectron. Reliab., 2014)

Thermal experimental and modeling analysis of high power 3D packages. - Herman Oprins; Vladimir Cherman; Geert Van der Plas; F. L. T. Maggioni; Joeri De Vos; Eric Beyne (ICICDT, 2015)

Reliability Challenges Related to TSV Integration and 3-D Stacking. - Kristof Croes; Joke De Messemaeker; Yunlong Li; Wei Guo; Olalla Varela Pedreira; Vladimir Cherman; Michele Stucchi; Ingrid De Wolf; Eric Beyne (IEEE Des. Test, 2016)

B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages. - Aidan Cowley; Andrej Ivankovic; C. S. Wong; N. S. Bennett; A. N. Danilewsky; Marcel Gonzalez; Vladimir Cherman; Bart Vandevelde; Ingrid De Wolf; Patrick J. McNally (Microelectron. Reliab., 2016)

Stress mitigation of 3D-stacking/packaging induced stresses. - Kristof Croes; Vladimir Cherman; Melina Lofrano; Houman Zahedmanesh; Luka Kljucar; Mario Gonzalez; Ingrid De Wolf; Zsolt Tökei; Eric Beyne (IRPS, 2018)

Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. - Melina Lofrano; Vladimir Cherman; Mario Gonzalez; Eric Beyne (Microelectron. Reliab., 2018)

Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications. - Kris Croes; Veerle Simons; Sofie Beyne; Vladimir Cherman; Herman Oprins; Michele Stucchi; Philippe Absil; A. Glabman; Eric Wilcox (IRPS, 2019)

Towards accurate temperature prediction in BEOL for reliability assessment (Invited). - Melina Lofrano; Herman Oprins; Xinyue Chang; Bjorn Vermeersch; Olalla Varela Pedreira; Alicja Lesniewska; Vladimir Cherman; Ivan Ciofi; Kristof Croes; Seongho Park; Zsolt Tokei (IRPS, 2023)