Flexible active cycle stress testing of smart power switches. - Michael Glavanovics; Helmut Köck; Vladimír Kosel; Tobias Smorodin (Microelectron. Reliab., 2007)

System level modeling of smart power switches using SystemC-AMS for digital protection concept verification. - Hans-Peter Kreuter; Vladimír Kosel; Michael Glavanovics; Robert Illing (BMAS, 2009)

IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures. - Helmut Köck; Vladimír Kosel; Christian Djelassi; Michael Glavanovics; Dionyz Pogany (Microelectron. Reliab., 2009)

Non-linear thermal modeling of DMOS transistor and validation using electrical measurements and FEM simulations. - Vladimír Kosel; Robert Illing; Michael Glavanovics; Alexander Satka (Microelectron. J., 2010)

ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness. - Stefano de Filippis; Vladimír Kosel; Donald Dibra; Stefan Decker; Helmut Köck; Andrea Irace (Microelectron. Reliab., 2011)

Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices. - Stefano de Filippis; Helmut Köck; Michael Nelhiebel; Vladimír Kosel; Stefan Decker; Michael Glavanovics; Andrea Irace (Microelectron. Reliab., 2012)

FEM simulation approach to investigate electro-thermal behavior of power transistors in 3-D. - Vladimír Kosel; Stefano de Filippis; Liu Chen; Stefan Decker; Andrea Irace (Microelectron. Reliab., 2013)