DLL based test solution for interposers in 2.5-D ICs. - Vladimir Mashkovtsev; Ali Attaran; Rashid Rashidzadeh (ISCAS, 2015)

A DLL-based test solution for through silicon via (TSV) in 3D-stacked ICs. - Rashid Rashidzadeh; Esrafil Jedari; Tareq Muhammad Supon; Vladimir Mashkovtsev (ITC, 2015)