Investigation of the fluid/structure interaction phenomenon in IC packaging. - C. Y. Khor; Mohd Zulkifly Abdullah; H. J. Tony Tan; W. C. Leong; D. Ramdan (Microelectron. Reliab., 2012)

Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance. - W. C. Leong; Mohd Zulkifly Abdullah; C. Y. Khor (Microelectron. Reliab., 2012)

Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology. - W. C. Leong; Mohd Zulkifly Abdullah; C. Y. Khor (Microelectron. Reliab., 2013)

Influence of solder bump arrangements on molded IC encapsulation. - C. Y. Khor; Mohd Zulkifly Abdullah; Chun-Sean Lau; W. C. Leong; M. S. Abdul Aziz (Microelectron. Reliab., 2014)