An Experience of Using FDOOA Method to Develop a Telecommunications Network Management System. - Y. S. Hung; W. C. Liu; C. G. Chung (TOOLS (24), 1997)

Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package. - C. T. Yang; W. C. Liu; C. Y. Liu (Microelectron. Reliab., 2012)