Improved physical understanding of intermittent failure in continuous monitoring method. - W. C. Maia Filho; M. Brizoux; Hélène Frémont; Yves Danto (Microelectron. Reliab., 2006)

Torsion test applied for reballing and solder paste volume evaluation. - W. C. Maia Filho; M. Brizoux; Hélène Frémont; Yves Danto (Microelectron. Reliab., 2007)

Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy. - B. Dompierre; W. C. Maia Filho; M. Brizoux; Véronique Aubin; Eric Charkaluk (Microelectron. Reliab., 2010)

Importance of electric resistance monitoring in shear test. - Stephane Zanella; A. Lecavelier des Etangs-Levallois; Eric Charkaluk; W. C. Maia Filho; A. Constantinescu (Microelectron. Reliab., 2018)