An examination of the applicability of the DNP metric on first level reliability assessments in underfilled electronic packages. - W. Dauksher; W. S. Burton (Microelectron. Reliab., 2003)

A methodology for the calculation of stress migration in die-level interconnects. - W. Dauksher; P. Marcoux; G. Castleman (Microelectron. Reliab., 2006)