The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. - T. Y. Lin; W. S. Leong; K. H. Chua; R. Oh; Y. Miao; J. S. Pan; J. W. Chai (Microelectron. Reliab., 2002)

Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. - T. Y. Lin; K. L. Davison; W. S. Leong; Simon Chua; Y. F. Yao; J. S. Pan; J. W. Chai; K. C. Toh; W. C. Tjiu (Microelectron. Reliab., 2003)