Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV). - Fa Xing Che; Wahyuaji Narottama Putra; A. Heryanto; A. Trigg; S. Gao; Chee Lip Gan (3DIC, 2011)

Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics. - F. L. Lau; Riko I. Made; Wahyuaji Narottama Putra; J. Z. Lim; V. C. Nachiappan; J. L. Aw; Chee Lip Gan (Microelectron. Reliab., 2013)