Analog CMOS processor for early vision processing with highly reduced power consumption. - Waldemar Jendernalik; Jacek Jakusz; Grzegorz Blakiewicz; Robert Piotrowski; Stanislaw Szczepanski (ECCTD, 2011)

Highly linear CMOS triode transconductor for VHF applications. - Waldemar Jendernalik; Stanislaw Szczepanski; Slawomir Koziel (IET Circuits Devices Syst., 2012)

An Analog Sub-Miliwatt CMOS Image Sensor With Pixel-Level Convolution Processing. - Waldemar Jendernalik; Grzegorz Blakiewicz; Jacek Jakusz; Stanislaw Szczepanski; Robert Piotrowski (IEEE Trans. Circuits Syst. I Regul. Pap., 2013)

An Ultra-Low-Energy Analog Comparator for A/D Converters in CMOS Image Sensors. - Waldemar Jendernalik (Circuits Syst. Signal Process., 2017)

A CMOS Pixel With Embedded ADC, Digital CDS and Gain Correction Capability for Massively Parallel Imaging Array. - Miron Klosowski; Waldemar Jendernalik; Jacek Jakusz; Grzegorz Blakiewicz; Stanislaw Szczepanski (IEEE Trans. Circuits Syst. I Regul. Pap., 2017)

A High-Efficient Measurement System With Optimization Feature for Prototype CMOS Image Sensors. - Miron Klosowski; Jacek Jakusz; Waldemar Jendernalik; Grzegorz Blakiewicz; Stanislaw Szczepanski; Slawomir Koziel (IEEE Trans. Instrum. Meas., 2018)

Light-Powered Starter for Micro-Power Boost DC-DC Converter for CMOS Image Sensors. - Grzegorz Blakiewicz; Jacek Jakusz; Miron Klosowski; Waldemar Jendernalik; Stanislaw Szczepanski (Circuits Syst. Signal Process., 2020)

A 1-nS 1-V Sub-1-µW Linear CMOS OTA with Rail-to-Rail Input for Hz-Band Sensory Interfaces. - Jacek Jakusz; Waldemar Jendernalik; Grzegorz Blakiewicz; Miron Klosowski; Stanislaw Szczepanski (Sensors, 2020)

Low-Power Receivers for Wireless Capacitive Coupling Transmission in 3-D-Integrated Massively Parallel CMOS Imager. - Grzegorz Blakiewicz; Miron Klosowski; Waldemar Jendernalik; Jacek Jakusz; Stanislaw Szczepanski (IEEE Trans. Circuits Syst. I Regul. Pap., 2020)

Single-Slope ADC With Embedded Convolution Filter for Global-Shutter CMOS Image Sensors. - Miron Klosowski; Yichuang Sun; Waldemar Jendernalik; Grzegorz Blakiewicz; Jacek Jakusz; Stanislaw Szczepanski (IEEE Trans. Circuits Syst. II Express Briefs, 2023)