Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting. - Stefan Martens; B. Krueger; Walter Mack; Friedemann Voelklein; Jürgen Wilde (Microelectron. Reliab., 2008)

A study on electrochemical effects in external capacitor packages. - Harald Preu; Jochen Feilmeier; Markus Lang; Norbert Soellner; Jürgen Walter; Walter Mack (Microelectron. Reliab., 2014)