Fast Thermal Simulation of FinFET Circuits Based on a Multiblock Reduced-Order Model. - Wangkun Jia; Brian T. Helenbrook; Ming-C. Cheng (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016)

A methodology for thermal simulation of interconnects enabled by model reduction with material property variation. - Wangkun Jia; Ming-C. Cheng (J. Comput. Sci., 2022)