Effects of copper CMP and post clean process on VRDB and TDDB at 28nm and advanced technology node. - Li Chieh Hsu; Yu-Min Lin; Chien Liang Wu; Wei Kun Lee; Yen Chun Liu; Cheng Pu Chiu; Hsin Kuo Hsu; Chun Yi Wang; Chien Chung Huang 002; Chin Fu Lin (IRPS, 2015)