An alternative bend-testing technique for a flexible indium tin oxide film. - Yen-Liang Chen; Hung-Chih Hsieh; Wang-Tsung Wu; Bor-Jiunn Wen; Wei-Yao Chang; Der-Chin Su (Displays, 2010)

Characteristic of copper wire and transient analysis on wirebonding process. - Hsiang-Chen Hsu; Wei-Yao Chang; Chang-Lin Yeh; Yi-Shao Lai (Microelectron. Reliab., 2011)