Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips. - Weishen Chu; Laura Spinella; Dwayne R. Shirley; Paul S. Ho (IRPS, 2020)

An Analytical Model for Thin Film Pattern-dependent Asymmetric Wafer Warpage Prediction. - Weishen Chu; Seyyed Ehsan Esfahani Rashidi; Yanli Zhang; Johann Alsmeier; Toshiyuki Sega (IMW, 2022)

Underwater image enhancement method with light scattering characteristics. - Jingchun Zhou; Xiaojing Wei; Jinyu Shi; Weishen Chu; Weishi Zhang (Comput. Electr. Eng., 2022)

Underwater image restoration via backscatter pixel prior and color compensation. - Jingchun Zhou; Tongyu Yang; Weishen Chu; Weishi Zhang (Eng. Appl. Artif. Intell., 2022)

Complex characteristics analysis of time-delay digital supply chain driven by cybersecurity. - Daoming Dai; Xuanyu Wu; Fengshan Si; Zhenan Feng; Weishen Chu (Kybernetes, 2023)