Anisotropic behavior of the capillary action in flip chip underfill. - Wen-Bin Young (Microelectron. J., 2003)

Experimental study of filling behaviors in the underfill encapsulation of a flip-chip. - Meng-Fu Shih; Wen-Bin Young (Microelectron. Reliab., 2009)

Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation. - Wen-Bin Young (Microelectron. Reliab., 2010)

Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA. - Ching-Ho Chang; Wen-Bin Young (Microelectron. Reliab., 2011)

Vacuum effect on the void formation of the molded underfill process in flip chip packaging. - Xue-Ru Guo; Wen-Bin Young (Microelectron. Reliab., 2015)

Application of lattice Boltzmann method in free surface flow simulation of micro injection molding. - Ying-Xuan Chen; Shing-Cheng Chang; Wen-Bin Young (Comput. Math. Appl., 2018)