An efficient 3D-IC on-chip test framework to embed TSV testing in memory BIST. - Liang-Che Li; Wen-Hsuan Hsu; Kuen-Jong Lee; Chun-Lung Hsu (ASP-DAC, 2015)

Built-In Test and Diagnosis for TSVs With Different Placement Topologies and Crosstalk Impact Ranges. - Wen-Hsuan Hsu; Michael Andreas Kochte; Kuen-Jong Lee (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017)