A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration. - Weng Hong Teh; Raymond Caramto; Jamal Qureshi; Sitaram Arkalgud; M. O'Brien; T. Gilday; Kou Maekawa; T. Saito; Kouichi Maruyama; Thenappan Chidambaram; Wei Wang 003; David Marx; et al. (3DIC, 2009)

Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding. - Weng Hong Teh; C. Deeb; J. Burggraf; D. Arazi; R. Young; C. Senowitz; A. Buxbaum (3DIC, 2010)