Phase Partition Based Virtual Metrology for Material Removal Rate Prediction in Chemical Mechanical Planarization Process. - Wenlan Jiang; Chunpu Lv; Tao Zhang 006; Huan-gang Wang (CICAI, 2021)

Virtual Metrology for Semiconductor Chemical Mechanical Planarization Process Using Wide & Deep Learning. - Fuzuo Zhang; Wenlan Jiang; Huan-gang Wang (ICCPR, 2021)