5.9 Haswell: A family of IA 22nm processors. - Nasser A. Kurd; Muntaquim Chowdhury; Edward Burton; Thomas P. Thomas; Christopher Mozak; Brent Boswell; Manoj Lal; Anant Deval; Jonathan Douglas; Ali M. El-Husseini; Ankireddy Nalamalpu; Timothy M. Wilson; et al. (ISSCC, 2014)

Lakefield: Hybrid cores in 3D Package. - Sanjeev Khushu; Wilfred Gomes (Hot Chips Symposium, 2019)

Towards Co-designing Neural Network Function Approximators with In-SRAM Computing. - Shamma Nasrin; Diaa Badawi; Ahmet Enis Çetin; Wilfred Gomes; Amit Ranjan Trivedi (EMC2@NeurIPS, 2019)

8.1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm2, 1mm Package-on-Package. - Wilfred Gomes; Sanjeev Khushu; Doug B. Ingerly; Patrick N. Stover; Nasirul I. Chowdhury; Frank O'Mahony; Ajay Balankutty; Noam Dolev; Martin G. Dixon; Lei Jiang; Surya Prekke; Biswajit Patra; et al. (ISSCC, 2020)

ENOS: Energy-Aware Network Operator Search for Hybrid Digital and Compute-in-Memory DNN Accelerators. - Shamma Nasrin; Ahish Shylendra; Yuti Kadakia; Nick Iliev; Wilfred Gomes; Theja Tulabandhula; Amit Ranjan Trivedi (CoRR, 2021)

MF-Net: Compute-In-Memory SRAM for Multibit Precision Inference Using Memory-Immersed Data Conversion and Multiplication-Free Operators. - Shamma Nasrin; Diaa Badawi; Ahmet Enis Çetin; Wilfred Gomes; Amit Ranjan Trivedi (IEEE Trans. Circuits Syst. I Regul. Pap., 2021)

Meteor Lake and Arrow Lake Intel Next-Gen 3D Client Architecture Platform with Foveros. - Wilfred Gomes; Slade Morgan; Boyd Phelps; Tim Wilson; Erik Hallnor (HCS, 2022)

Ponte Vecchio: A Multi-Tile 3D Stacked Processor for Exascale Computing. - Wilfred Gomes; Altug Koker; Patrick N. Stover; Doug B. Ingerly; Scott Siers; Srikrishnan Venkataraman; Chris Pelto; Tejas Shah; Amreesh Rao; Frank O'Mahony; Eric Karl; Lance Cheney; et al. (ISSCC, 2022)

ENOS: Energy-Aware Network Operator Search in Deep Neural Networks. - Shamma Nasrin; Ahish Shylendra; Nastaran Darabi; Theja Tulabandhula; Wilfred Gomes; Ankush Chakrabarty; Amit Ranjan Trivedi (IEEE Access, 2022)

Memory-Immersed Collaborative Digitization for Area-Efficient Compute-in-Memory Deep Learning. - Shamma Nasrin; Maeesha Binte Hashem; Nastaran Darabi; Benjamin Parpillon; Farah Fahim; Wilfred Gomes; Amit Ranjan Trivedi (AICAS, 2023)

MC-CIM: Compute-in-Memory With Monte-Carlo Dropouts for Bayesian Edge Intelligence. - Priyesh Shukla; Shamma Nasrin; Nastaran Darabi; Wilfred Gomes; Amit Ranjan Trivedi (IEEE Trans. Circuits Syst. I Regul. Pap., 2023)

A 5.4V-Vin, 9.3A/mm2 10MHz Buck IVR Chiplet in 55nm BCD Featuring Self-Timed Bootstrap and Same-Cycle ZVS Control. - Sally Amin; Harish Krishnamurthy; Huong T. Do; Claudio Alvarez; Mike Hill; Kaladhar Radhakrishnan; Vivek De; Sheldon Weng; Krishnan Ravichandran; Jim Tschanz; Wilfred Gomes; Jonathan Douglas (VLSI Technology and Circuits, 2024)

ADC/DAC-Free Analog Acceleration of Deep Neural Networks With Frequency Transformation. - Nastaran Darabi; Maeesha Binte Hashem; Hongyi Pan; Ahmet Enis Çetin; Wilfred Gomes; Amit Ranjan Trivedi (IEEE Trans. Very Large Scale Integr. Syst., 2024)