Novel low temperature 3D wafer stacking technology for high density device integration. - Ionut Radu; Gweltaz Gaudin; William van den Daele; Fabrice Letertre; Carlos Mazure; Léa Di Cioccio; Thomas Lacave; Frederic Mazen; Pascal Scheiblin; Thomas Signamarcheix; Sorin Cristoloveanu (ESSDERC, 2013)

Superior performance and Hot Carrier reliability of Strained FDSOI nMOSFETs for advanced CMOS technology nodes. - Guillaume Besnard; Xavier Garros; François Andrieu; Phuong Nguyen; William van den Daele; Patrick Reynaud; Walter Schwarzenbach; Daniel Delprat; Konstantin Bourdelle; Gilles Reimbold; Sorin Cristoloveanu (ESSDERC, 2014)