Evaluation of 3DICs and fabrication of monolithic interlayer vias. - William Wahby; Ashish Dembla; Muhannad S. Bakir (3DIC, 2013)

The impact of 3D stacking on GPU-accelerated deep neural networks: An experimental study. - William Wahby; Thomas E. Sarvey; Hardik Sharma; Hadi Esmaeilzadeh; Muhannad S. Bakir (3DIC, 2016)

Design considerations for 2.5-D and 3-D integration accounting for thermal constraints. - Yang Zhang; Xuchen Zhang; William Wahby; Muhannad S. Bakir (3DIC, 2016)

Statistical Characterization of ReRAM Arrays for Analog In-Memory Computing. - Jesse Short; Matthew Spear; Donald Wilson; William Wahby; T. Patrick Xiao; Robin Jacobs-Gedrim; Christopher H. Bennett; Nad Gilbert; Sapan Agarwal; Matthew J. Marinella (ICRC, 2023)

A Discovery Platform to Characterize Emerging Nonvolatile Memories for Computing. - D. Wilson; Nad E. Gilbert; Matt Spear; J. Short; Christopher H. Bennett; William Wahby; Joshua E. Kim; Robin Jacobs-Gedrim; Tianyao Patrick Xiao; S. Agarwal; Matthew J. Marinella (VTS, 2024)

Self-heating electrochemical memory for high-precision analog computing. - Adam L. Gross; Sangheon Oh; François Léonard; Wyatt Hodges; T. Patrick Xiao; Joshua D. Sugar; Jacklyn Zhu; Sritharini Radhakrishnan; Sangyong Lee; Jolie Wang; Adam S. Christensen; Sam Lilak; et al. (CoRR, 2025)