MCM technology and design for the S/390 G5 system. - George A. Katopis; Wiren Dale Becker; Toufie R. Mazzawy; Howard H. Smith; Charles K. Vakirtzis; Scott A. Kuppinger; Bhupindra Singh; Phillip C. Lin; John Bartells Jr.; Gregory V. Kihlmire; Panangattur N. Venkatachalam; Herb I. Stoller; et al. (IBM J. Res. Dev., 1999)

Macromodeling of Digital I/O Ports for System EMC Assessment . - Igor S. Stievano; Flavio G. Canavero; Ivan A. Maio; Z. Chen; Wiren Dale Becker; George A. Katopis (DATE, 2002)

First- and second-level packaging for the IBM eServer z900. - Hubert Harrer; Harald Pross; Thomas-Michael Winkel; Wiren Dale Becker; Herb I. Stoller; Masakazu Yamamoto; Shinji Abe; Bruce J. Chamberlin; George A. Katopis (IBM J. Res. Dev., 2002)

A power, packaging, and cooling overview of the IBM eServer z900. - Prabjit Singh; Steven J. Ahladas; Wiren Dale Becker; Frank E. Bosco; Joseph P. Corrado; Gary F. Goth; Sushumna Iruvanti; Matthew A. Nobile; Budy D. Notohardjono; John H. Quick; Edward J. Seminaro; Kwok M. Soohoo; et al. (IBM J. Res. Dev., 2002)

First- and second-level packaging of the z990 processor cage. - Thomas-Michael Winkel; Wiren Dale Becker; Hubert Harrer; Harald Pross; Dierk Kaller; Bernd Garben; Bruce J. Chamberlin; Scott A. Kuppinger (IBM J. Res. Dev., 2004)

Electronic packaging of the IBM z13 processor drawer. - Wiren Dale Becker; Hubert Harrer; Andreas Huber; W. L. Brodsky; R. Krabbenhoft; M. A. Cracraft; Dierk Kaller; Gregory R. Edlund; Thomas Strach (IBM J. Res. Dev., 2015)

Polynomial Chaos modeling for jitter estimation in high-speed links. - Majid Ahadi Dolatsara; Huan Yu; Jose Ale Hejase; Wiren Dale Becker; Madhavan Swaminathan (ITC, 2018)

IBM POWER9 package technology and design. - Sungjun Chun; Wiren Dale Becker; Jon Casey; Steve Ostrander; Daniel Dreps; Jose Ale Hejase; Ryan Nett; Brian Beaman; Jason R. Eagle (IBM J. Res. Dev., 2018)

A Hybrid Methodology for Jitter and Eye Estimation in High-Speed Serial Channels Using Polynomial Chaos Surrogate Models. - Majid Ahadi Dolatsara; Jose Ale Hejase; Wiren Dale Becker; Madhavan Swaminathan (IEEE Access, 2019)