Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy. - Wissam Sabbah; Stephane Azzopardi; Cyril Buttay; Régis Meuret; Eric Woirgard (Microelectron. Reliab., 2013)

Identification and analysis of power substrates degradations subjected to severe aging tests. - Eric Woirgard; Faical Arabi; Wissam Sabbah; Donatien Martineau; L. Théolier; Stephane Azzopardi (Microelectron. Reliab., 2015)

Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling. - Wissam Sabbah; Faical Arabi; Oriol Avino-Salvado; Cyril Buttay; L. Théolier; Hervé Morel (Microelectron. Reliab., 2017)

High temperature ageing of microelectronics assemblies with SAC solder joints. - Wissam Sabbah; Pierre Bondue; Oriol Avino-Salvado; Cyril Buttay; Hélène Frémont; Alexandrine Guédon-Gracia; Hervé Morel (Microelectron. Reliab., 2017)