High-precision interconnect analysis. - Rui Escadas Martins; Wolfgang Pyka; Rainer Sabelka; Siegfried Selberherr (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1998)

Three-dimensional simulation of HPCVD-linking continuum transport and reaction kinetics with topography simulation. - Wolfgang Pyka; Peter Fleischmann; Bernhard Haindl; Siegfried Selberherr (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1999)

Simulation of arsenic in situ doping with polysilicon CVD and its application to high aspect ratio trenches. - Clemens Heitzinger; Wolfgang Pyka; Naoki Tamaoki; Toshiro Takase; Toshimitsu Ohmine; Siegfried Selberherr (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2003)