SiC devices for advanced power and high-temperature applications. - Wolfgang Wondrak; Raban Held; Ekkehard Niemann; Ulrich Schmid (IEEE Trans. Ind. Electron., 2001)

High temperature reliability testing of aluminum and tantalum electrolytic capacitors. - A. Dehbi; Wolfgang Wondrak; Yves Ousten; Yves Danto (Microelectron. Reliab., 2002)

Special Section on Reliability of Passive Components. - Wolfgang Wondrak (Microelectron. Reliab., 2002)

Vibration lifetime modelling of PCB assemblies using steinberg model. - A. Dehbi; Yves Ousten; Yves Danto; Wolfgang Wondrak (Microelectron. Reliab., 2005)

Defect detection in multilayer ceramic capacitors. - V. Krieger; Wolfgang Wondrak; A. Dehbi; W. Bartel; Yves Ousten; Bruno Levrier (Microelectron. Reliab., 2006)

Part average analysis - A tool for reducing failure rates in automotive electronics. - M. Wagner; W. Unger; Wolfgang Wondrak (Microelectron. Reliab., 2006)

Ball grid array (BGA) solder joint intermittency real-time detection. - N. Roth; Wolfgang Wondrak; A. Willikens; James Hofmeister (Microelectron. Reliab., 2008)

Dielectric strength and thermal performance of PCB-embedded power electronics. - Richard Randoll; Wolfgang Wondrak; Andreas Schletz (Microelectron. Reliab., 2014)

Characteristics and aging of PCB embedded power electronics. - Richard Randoll; Mahmud Asef; Wolfgang Wondrak; Lars Böttcher; Andreas Schletz (Microelectron. Reliab., 2015)

Lifetime and manufacturability of integrated power electronics. - Richard Randoll; Wolfgang Wondrak; Andreas Schletz (Microelectron. Reliab., 2016)

Advantageous Fault-tolerant Multilevel and Multiphase Inverter Systems for Automotive Electric Powertrains. - Michael Gleissner; Johannes Häring; Mark-M. Bakran; Wolfgang Wondrak; Maximilian Hepp (EVER, 2020)