Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking. - Sung Chul Hong; Wang Gu Lee; Won Joong Kim; Jong Hyeong Kim; Jae Pil Jung (Microelectron. Reliab., 2011)

Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps. - Myong-Hoon Roh; Jae Pil Jung; Won Joong Kim (Microelectron. Reliab., 2014)

Forecasting CDS Term Structure Based on Nelson-Siegel Model and Machine Learning. - Won Joong Kim; Gunho Jung; Sun-Yong Choi (Complex., 2020)

An Improved Time-Series Forecasting Model Using Time Series Decomposition and GRU Architecture. - Hyun Jae Jo; Won Joong Kim; Hyo Kyung Goh; Chi-Hyuck Jun (ICONIP (6), 2021)