Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. - Woon-Seong Kwon; Suk-Jin Ham; Kyung-Wook Paik (Microelectron. Reliab., 2006)

Chip warpage model for reliability prediction of delamination failures. - Se Young Yang; Woon-Seong Kwon; Soon-Bok Lee (Microelectron. Reliab., 2012)