Virtual qualification of moisture induced failures of advanced packages. - Marcel A. J. van Gils; W. D. van Driel; G. Q. Zhang; H. J. L. Bressers; Richard B. R. van Silfhout; X. J. Fan; J. H. J. Janssen (Microelectron. Reliab., 2007)

Experimental investigations and model study of moisture behaviors in polymeric materials. - X. J. Fan; S. W. Ricky Lee; Q. Han (Microelectron. Reliab., 2009)

Design and optimization of thermo-mechanical reliability in wafer level packaging. - X. J. Fan; B. Varia; Q. Han (Microelectron. Reliab., 2010)

New complexity analysis of a full-Newton step feasible interior-point algorithm for P∗(κ)-LCP. - G. Q. Wang; X. J. Fan; D. T. Zhu; D. Z. Wang (Optim. Lett., 2015)

An accelerated test method of luminous flux depreciation for LED luminaires and lamps. - C. Qian; X. J. Fan; J. J. Fan; Cadmus A. Yuan; Guo Qi Zhang (Reliab. Eng. Syst. Saf., 2016)