Improved MSEL and its Medical Application. - Huiguang He; Jie Tian 001; Jing Wang; Hong Chen; X. P. Zhang (ICPR (2), 2002)

Size and constraint effects on interfacial fracture behavior of microscale solder interconnects. - B. Li; X. P. Zhang; Y. Yang; L. M. Yin; Michael G. Pecht (Microelectron. Reliab., 2013)

Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints. - H. B. Qin; Wang-Yun Li; M. B. Zhou; X. P. Zhang (Microelectron. Reliab., 2014)

Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints. - H. B. Qin; X. P. Zhang; M. B. Zhou; X. P. Li; Yiu-Wing Mai (Microelectron. Reliab., 2015)