A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages. - X. Q. Shi; Z. P. Wang; J. P. Pickering (Microelectron. Reliab., 2003)

Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. - X. Q. Shi; John H. L. Pang; X. R. Zhang (Microelectron. Reliab., 2004)