Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. - Tong Yan Tee; Chek Lim Kho; Daniel Yap; Carol Toh; Xavier Baraton; Zhaowei Zhong (Microelectron. Reliab., 2003)

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. - Tong Yan Tee; Hun Shen Ng; Daniel Yap; Xavier Baraton; Zhaowei Zhong (Microelectron. Reliab., 2003)

Interface delamination analysis of TQFP package during solder reflow. - Hu Guojun; Roberto Rossi; Jing-en Luan; Xavier Baraton (Microelectron. Reliab., 2010)