SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging. - Xi-Shu Wang; Xu-Dong Li; Huai-Hui Ren; Hai-Yan Zhao; Ryosuke Murai (Microelectron. Reliab., 2011)

Fracture analysis on die attach adhesives for stacked packages based on in-situ testing and cohesive zone model. - Huai-Hui Ren; Xi-Shu Wang; Su Jia (Microelectron. Reliab., 2013)

Effects of solder balls and arrays on the failure behavior in Package-on-Package structure. - Xi-Shu Wang; Su Jia; Huai-Hui Ren; Pan Pan (Microelectron. Reliab., 2014)

Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure. - Zhi-Hao Zhang; Xi-Shu Wang; Huai-Hui Ren; Su Jia; Hui-Hua Yang (Microelectron. Reliab., 2017)